Deca Announces Contract with IBM to Bring High-Density Fan-Out Interposer Production to North America

Deca and IBM partner to bring high-volume fan-out interposer tech to North America, advancing AI and HPC chiplet product packaging at IBM’s Bromont website.

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TEMPE, Ariz., May 20, 2025 (GLOBE WIRE SERVICE)– Deca Technologies today revealed the finalizing of an agreement with IBM to implement Deca’s M-SeriesTM and Adaptive Patterning ® modern technologies in IBM’s advanced product packaging facility in Bromont, Quebec. Deca’s M-Series system is the highest-volume fan-out product packaging modern technology in the globe, with over 7 billion M-Series units delivered. By combining IBM’s advanced product packaging capabilities with Deca’s tried and tested innovation, the two firms are expanding the global supply chain for the future of high-performance chiplet combination and advanced computer systems. Regarding Deca Technologies Deca is a leading supplier of advanced-packaging innovation to the semiconductor industry with M-SeriesTM fan-out technology and Flexible Patterning ®.

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Kingsman a 35-year-old financial advisor from London, UK, epitomizes the blend of analytical prowess and personable guidance. With a decade of experience in the financial sector, Kingsman has cultivated a reputation for his strategic approach to wealth management and investment advising. His journey began at the University of Oxford, where he graduated with honours in Economics, a discipline that fueled his fascination with the financial markets and their intricacies.

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